Uttar Pradesh Plans 1,000-Acre Semiconductor Park Near Noida International Airport
October 3, 2026: Uttar Pradesh is planning a 1,000-acre semiconductor park in Sector 10 of the Yamuna Expressway Industrial Development Authority (YEIDA) area, about 2.5 km from Noida International Airport, according to a September 29 report by Convergence. The move signals the state's ambition to go beyond electronics assembly into chip packaging, design and potentially wafer fabrication.
What We Know
- The planned park is in the YEIDA region along the Yamuna Expressway in Gautam Buddha Nagar district.
- The report said the state has over ₹32,000 crore in approved semiconductor proposals and is aligning its incentives with the Centre's India Semiconductor Mission (ISM) 2.0 framework.
- A PTI report in mid-September said a semiconductor ATMP (assembly, testing, marking and packaging) facility with an investment of about ₹3,700 crore had been approved, and noted the presence of global chip ecosystem firms such as NXP, Renesas, Qualcomm and Cadence in the state. A 75-acre robotics and AI computing park in Greater Noida is also planned.
The HCL–Foxconn Unit
The HCL Group and Foxconn joint venture is building a chip assembly and testing (OSAT) facility in YEIDA's Sector 28, with an investment of around ₹3,706 crore. Its foundation stone was laid in February 2026.
Why the Location Matters
Noida International Airport at Jewar began flight operations on June 15, 2026. Semiconductors are high-value, low-weight products often shipped by air, so proximity to a cargo-capable airport, expressways and the dedicated freight corridors is a strong advantage.
The Bigger Picture
India launched the India Semiconductor Mission in December 2021 to build a domestic chip ecosystem. Approved projects include Tata Electronics' fab at Dholera in Gujarat and several assembly and testing plants in Gujarat, Assam and elsewhere. States including Gujarat, Assam, Odisha and Uttar Pradesh are competing for investment with land, power and capital subsidies.
Challenges
Chip manufacturing needs uninterrupted power, very large volumes of ultra-pure water, skilled engineers and a network of chemical and gas suppliers. Fabs cost billions of dollars and take years to build, so most early projects in India are in packaging and testing.
What Happens Next
Watch for formal notification of the park, land allotment to investors and approvals under ISM 2.0.
FAQ
What is an OSAT or ATMP facility?
It packages and tests chips made in fabs, turning silicon dies into finished components ready for devices.
Is Uttar Pradesh building a chip fab?
The state has stated ambitions for wafer fabrication, but announced projects so far focus on packaging, testing and design.